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AW200 Series C-SAM

Company : Sonoscan Inc

UMDC Code : 103343

The AW200 Series is a high-capacity, high-throughput automated C-SAM system designed to deliver maximum sensitivity for the evaluation of bonded wafers in applications such as SOI, MEMS and others. Since the materials used in these applications are very transparent to ultrasound, Sonoscan uses proprietary high acoustic frequency lenses, which are designed in-house, to obtain the most detailed images. The AW200 Series can detect voids smaller than 5 microns in diameter between two wafers and delamination with the separation between the wafers as thin as 200 Angstroms.

Product URL : http://www.sonoscan.com/instruments/aw-csam.html

Last Updated : 11/09/2012

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